Background
In June 2024, we partnered with TechSphere in Tokyo. TechSphere, with operations spanning Asia, from the bustling streets of Seoul to the tech hubs of Bangkok, needed a reliable partner to build its new mini PC case. Rapido, leveraging its advanced CNC machining technology, undertook the production of 1,800 mini PC cases in just five weeks.
Challenges and Requirements
TechSphere’s mini PC case had to be top-notch. Based on our conversations and prototype images, we understood their requirements:
Main Case: A sleek anodized 6061 aluminum chassis measuring 250mm x 200mm x 80mm. Motherboard mounting requires ultra-high precision, with a tolerance of ±0.015mm. They keep the weight under 600g, and the Rapidefficient team hand-polishes the brushed finish for a premium feel.
Ventilation and Ports: 1.5mm slots for airflow and the SB port are meticulously cut, and considerable effort is spent to avoid rough edges. These slots must withstand 120,000 thermal cycles and are tested under simulated heat loads to ensure durability.
Mounting Frame: A steel alloy bracket with drilled holes for GPU and SSD mounting, with an accuracy of ±0.007mm. Each component is hand-inspected to ensure a tight fit.
The project was high stakes – meeting Japanese safety regulations, using 90% recycled materials, and staying on budget. Working under such a tight timeline required them to rely on craftsmanship, good judgment, and the synergy of their machines.
Our Approach
At our Shenzhen factory, we worked tirelessly on CAD designs, managing to reduce material usage by 10% while maintaining strength. We milled the chassis in small batches and visually inspected each one before moving on to the next step.
Artisan Craftsmanship: Workers took the time to hand-polish the edges of the vents, achieving a 0.5-micron finish that machines can’t achieve, extending the chassis’ lifespan.
Real-World Testing: We built a custom test rig using fans and simulated parts, cycling the temperature to 60°C to simulate the heat of a Japanese summer. Hand-tuning ensured the frame remained rigid and the chassis didn’t warp.
Sustainability Commitment: We collected and recycled aluminum scrap locally, keeping waste to less than 3%.
Minor production issues, such as small port alignment issues, were resolved by hand-adjusting the jig—real solutions, not software tricks.
Results
By the end of August 2024, Rapidefficient delivered all 1,800 chassis enclosures on schedule. TechSphere showcased its mini PC at a Tokyo expo, and sales surged 35%, particularly among gamers. One engineer remarked, “The Rapidefficient team really put a lot of effort into the craftsmanship—it’s durable and beautiful!”
This award has sparked discussions for TechSphere’s new VR device enclosure. At Rapidefficient, Shenzhen’s cutting-edge manufacturing technology is seamlessly integrated with precise craftsmanship.
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